View MPX4105A_1282930.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

Freescale Semiconductor Technical Data
Document Number: MPX4105A Rev 6, 07/2006
Integrated Silicon Pressure Sensor for Manifold Absolute Pressure Applications On-Chip Signal Conditioned, Temperature Compensated and Calibrated
The Freescale MPX4105A series Manifold Absolute Pressure (MAP) sensor for engine control is designed to sense absolute air pressure within the intake manifold. This measurement can be used to compute the amount of fuel required for each cylinder. Freescale's MAP sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The small form factor and high reliability of on-chip integration make the Freescale MAP sensor a logical and economical choice for the automotive system designer. The MPX4105A series piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. Features * * * * 1.8% Maximum Error Over 0 to 85C Specifically Designed for Intake Manifold Absolute Pressure Sensing in Engine Control Systems Temperature Compensated Over -40 to +125C Durable Epoxy Unibody Element
MPX4105A SERIES
INTEGRATED PRESSURE SENSOR 15 TO 105 kPA (2.2 TO 15.2 psi) 0.3 TO 4.9 V OUTPUT
UNIBODY PACKAGE
MPX4105A CASE 867-08
PIN NUMBERS(1)
1 2 3 Vout GND VS 4 5 6 N/C N/C N/C
Typical Applications * * * Manifold Sensing for Automotive Systems Ideally Suited for Microprocessor or Microcontroller-Based Systems Also Ideal for Non-Automotive Applications ORDERING INFORMATION
Device Type Options Case No. MPX Series Order No. MPX4105A Device Marking
1. Pins 4, 5, and 6 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead.
UNIBODY PACKAGE (MPX4105A SERIES) Basic Element Absolute, Element 867 MPX4105A
(c) Freescale Semiconductor, Inc., 2006. All rights reserved.
VS
Sensing Element
Thin Film Temperature Compensation and Gain Stage #1
Gain Stage #2 and Ground Reference Shift Circuitry
Vout
GND
Pins 4, 5, and 6 are NO CONNECTS for unibody devices.
Figure 1. Fully Integrated Pressure Sensor Schematic
Table 1. Maximum Ratings(1)
Rating Maximum Pressure (P1 > P2) Storage Temperature Operating Temperature Symbol PMAX TSTG TA Value 400 -40 to +125 -40 to +125 Unit kPa C C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
MPX4105A 2 Sensors Freescale Semiconductor
Table 2. Operating Characteristics (VS = 5.1 Vdc, TA = 25C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 3 required to meet electrical specifications.)
Characteristic Pressure Range Supply Voltage Supply Current Minimum Pressure Offset Full Scale Output Full Scale Span Accuracy(6) Sensitivity Response Time(7) Output Source Current at Full Scale Output Warm-Up Time(8) Offset Stability(9) 1. 2. 3. 4. 5. 6.
(4) (3) (1)
Symbol POP VS Io (0 to 85C) (0 to 85C) (0 to 85C) (0 to 85C) Voff VFSO VFSS -- V/P tR Io+ -- --
Min 15 4.85 -- 0.184 4.804 -- -- -- -- -- -- --
Typ -- 5.1 7.0 0.306 4.896 4.590 -- 51 1.0 0.1 15 0.65
Max 105 5.35 10 0.428 4.988 -- 1.8 -----------
Unit kPa Vdc mAdc Vdc Vdc Vdc %VFSS mV/kPa ms mAdc ms %VFSS
(2)
(5)
7. 8. 9.
1.0 kPa (kiloPascal) equals 0.145 psi. Device is ratiometric within this specified excitation range. Offset (Voff) is defined as the output voltage at the minimum rated pressure. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. Accuracy (error budget) consists of the following: * Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. * Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. * Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25C. * TcSpan: Output deviation over the temperature range of 0 to 85C, relative to 25C. * TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85C, relative to 25C. * Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25C. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
Table 3. Mechanical Characteristics
Characteristics Weight, Basic Element (Case 867) Typ 4.0 Unit grams
MPX4105A Sensors Freescale Semiconductor 3
ON-CHIP TEMPERATURE COMPENSATION AND CALIBRATION
Fluoro Silicone Gel Die Coat Die P1 Wire Bond Epoxy Plastic Case Stainless Steel Cap
Lead Frame
Die Bond Absolute Element P2
Sealed Vacuum Reference
Figure 2. Cross Sectional Diagram (not to scale) (For additional output filtering, please refer to Application Note AN1646)
Vout Vs Output (Volts) IPS 1.0 F 0.01 F GND 470 pF Output 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 Transfer Function: Vout = Vs* (0.01*P-0.09) Error VS = 5.1 Vdc Temperature = 0 to 85C 20 kPa to 105 kPa MPX4105A MAX MIN TYP
+5 V
Figure 3. Recommended Power Supply Decoupling and Output Filtering
Figure 2 illustrates an absolute sensing chip in the basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MPX4105A series pressure sensor operating characteristics, internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application.
Figure 3 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Figure 4 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for operation over a temperature range of 0 to 85C. The output will saturate outside of the specified pressure range.
MPX4105A 4 Sensors Freescale Semiconductor
5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 Pressure (ref: to sealed vacuum) in kPa
Figure 4. Output versus Absolute Pressure
Transfer Function (MPX4105A)
Nominal Transfer Value: Vout = VS (P x 0.01 - 0.09) (Pressure Error x Temp. Factor x 0.01 x VS) VS = 5.1 V 0.25 Vdc
Temperature Error Band
MPX4105A Series
4.0 3.0 Temperature Error Factor 2.0 1.0 0.0 -40 -20 0 20
Break Points Temp -40 -20 0 to 85 125 Multiplier 3.0 1.5 1.0 2.5
40
60
80
100
120
140
Temperature in C NOTE: The Temperature Multiplier is a linear response from -40C to -20C, -20C to 0C, and from 85C to 125C.
Pressure Error Band
3.0 2.0 Pressure Error (kPa) 1.0 0.0 -1.0 -2.0 -3.0 20
Error Limits for Pressure
40
60
80
100
120
Pressure (in kPa)
Pressure 40 to 94 (kPa) 15 (kPa) 105 (kPa)
Error (Max) 1.5 (kPa) 2.4 (kPa) 1.8 (kPa)
MPX4105A Sensors Freescale Semiconductor 5
PACKAGE DIMENSIONS
C R M B -AN
PIN 1 SEATING PLANE
1 2 3 4 5 6
POSITIVE PRESSURE (P1)
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630).
INCHES MILLIMETERS MIN MAX MIN MAX 0.595 0.630 15.11 16.00 0.514 0.534 13.06 13.56 0.200 0.220 5.08 5.59 0.027 0.033 0.68 0.84 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.40 0.014 0.016 0.36 0.695 0.725 17.65 18.42 30 NOM 30 NOM 0.475 0.495 12.07 12.57 0.430 0.450 10.92 11.43 0.090 0.105 2.29 2.66
L
-TG F D 6 PL 0.136 (0.005)
M
J S
TA
M
DIM A B C D F G J L M N R S OPEN GROUND +VOUT +VSUPPLY -VOUT OPEN
STYLE 1: PIN 1. 2. 3. 4. 5. 6.
VOUT GROUND VCC V1 V2 VEX
STYLE 2: PIN 1. 2. 3. 4. 5. 6.
OPEN GROUND -VOUT VSUPPLY +VOUT OPEN
STYLE 3: PIN 1. 2. 3. 4. 5. 6.
CASE 867-08 ISSUE N UNIBODY PACKAGE
MPX4105A 6 Sensors Freescale Semiconductor
How to Reach Us:
Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 +1-800-521-6274 or +1-480-768-2130 www.freescale.com/support Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) www.freescale.com/support Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-441-2447 or 303-675-2140 Fax: 303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com
Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals", must be validated for each customer application by customer's technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. FreescaleTM and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. (c) Freescale Semiconductor, Inc. 2006. All rights reserved.
MPX4105A Rev. 6 07/2006

▲Up To Search▲

Price & Availability of MPX4105A

	To Download MPX4105A Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .